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Patent Searching and Data


Title:
POLYMER FILM AND METHOD FOR PREPARATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2003/024695
Kind Code:
A1
Abstract:
A polymer film, characterized in that it is obtainable by a method comprising extruding an isotropic solution of a liquid crystalline polymer being rigid and having high heat resistance, such as polybenzazole, in a solvent such as polyphosphoric acid into a film form from a die slit, subsequently stretching the solution in a film form at least uniaxially, followed by coagulation and washing&semi and a method for preparing the polymer film. The polymer film is uniform, exhibits high heat resistance, a high strength and a high coefficient of elasticity, is reduced in the anisotropy of mechanical properties and has high peeling strength, and thus can be widely used in electrical and electronic applications such as a magnetic recording film, an electronic circuit board and a substrate for mounting electronic parts, a reinforcement in a composite material, space and aviation applications such as a preventive film for the surface of a structure, and the like.

Inventors:
MURASE HIROKI (JP)
WATANUKI SEIJI (JP)
TERAMOTO YOSHIHIKO (JP)
Application Number:
PCT/JP2002/009510
Publication Date:
March 27, 2003
Filing Date:
September 17, 2002
Export Citation:
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Assignee:
TOYO BOSEKI (JP)
MURASE HIROKI (JP)
WATANUKI SEIJI (JP)
TERAMOTO YOSHIHIKO (JP)
International Classes:
B29C55/00; B29D7/01; C08J5/18; H05K1/03; (IPC1-7): B29C55/02; B29C55/28; C08J5/18
Domestic Patent References:
WO1992010527A11992-06-25
Foreign References:
EP0377963A21990-07-18
JPS6374612A1988-04-05
JPH01287141A1989-11-17
JP2000273214A2000-10-03
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