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Title:
POLYMER FOR PHOTORESIST AND RESIN COMPOSITIONS THEREFOR
Document Type and Number:
WIPO Patent Application WO/2002/048217
Kind Code:
A1
Abstract:
A polymer for photoresist comprising at least one kind of monomer units represented by the general formula (I): (I) (wherein R?1¿, R?2¿, R?3¿, R?4¿, and R?5¿ are each independently hydrogen or methyl; m, p, and q are each an integer of 0 to 2; and n is 0 or 1, with the proviso that the hydroxyl group and the carbonyloxy group attached to the main chain are bonded to one of the two left-end carbon atoms of the ring). When this polymer is used as the base of photoresist, the resulting photoresist is well balanced between adhesion to a substrate and etching resistance.

Inventors:
FUNAKI YOSHINORI (JP)
TSUTSUMI KIYOHARU (JP)
INOUE KEIZO (JP)
ADACHI TOMOKO (JP)
Application Number:
PCT/JP2001/010832
Publication Date:
June 20, 2002
Filing Date:
December 11, 2001
Export Citation:
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Assignee:
DAICEL CHEM (JP)
FUNAKI YOSHINORI (JP)
TSUTSUMI KIYOHARU (JP)
INOUE KEIZO (JP)
ADACHI TOMOKO (JP)
International Classes:
G03F7/039; (IPC1-7): C08F20/28; C07D305/14; C07D307/93; C07D311/94; C07D313/06; C07D313/20; G03F7/039
Foreign References:
JP2001242627A2001-09-07
JP2000122294A2000-04-28
JPH10207069A1998-08-07
JP2000159758A2000-06-13
Other References:
See also references of EP 1354897A4
Attorney, Agent or Firm:
Goto, Yukihisa (Higashitenma 2-chome Kita-ku Osaka-shi, Osaka, JP)
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