Title:
POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST
Document Type and Number:
WIPO Patent Application WO/2001/057597
Kind Code:
A1
Abstract:
A polymeric compound for photoresists which comprises monomer units represented by formula (I); and a resin composition for photoresists which comprises the polymeric compound and a photo-acid generator. The composition has high adhesion to substrates and can precisely form a fine pattern.
Inventors:
FUNAKI YOSHINORI (JP)
TSUTSUMI KIYOHARU (JP)
TAKARAGI AKIRA (JP)
TSUTSUMI KIYOHARU (JP)
TAKARAGI AKIRA (JP)
Application Number:
PCT/JP2001/000515
Publication Date:
August 09, 2001
Filing Date:
January 26, 2001
Export Citation:
Assignee:
DAICEL CHEM (JP)
FUNAKI YOSHINORI (JP)
TSUTSUMI KIYOHARU (JP)
TAKARAGI AKIRA (JP)
FUNAKI YOSHINORI (JP)
TSUTSUMI KIYOHARU (JP)
TAKARAGI AKIRA (JP)
International Classes:
C08F18/00; C08F20/10; C08F22/06; C08F32/00; C08F32/08; H01L21/027; C08F232/02; G03F7/039; G03F7/004; (IPC1-7): G03F7/039; C08F32/00; C08F20/10; C08F22/06; H01L21/027
Foreign References:
| JPH10218941A | 1998-08-18 | |||
| JPH11305444A | 1999-11-05 | |||
| US6103845A | 2000-08-15 | |||
| JPH11352693A | 1999-12-24 | |||
| GB2332679A | 1999-06-30 | |||
| US6063542A | 2000-05-16 |
Other References:
See also references of EP 1172694A4
Attorney, Agent or Firm:
Goto, Yukihisa (Higashitenma 2-chome Kita-ku Osaka-shi Osaka, Higashitenma 2-chome Kita-ku Osaka-shi Osaka, JP)
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