POLYMERIC COMPOUND AND RESIN COMPOSITION CONTAINING SAID COMPOUND

WIPO Patent Application WO/2023/120234

A1

Provided is a polymeric compound represented by formula (1) (in formula (1), R1, R2, R3 and R4 each independently represent a methyl group, an ethyl group, an isopropyl group, or a tertiary butyl group; X's each independently represent an acetyl group or a partial structure represented by formula (2) (in formula (2), R5 represents a hydrogen atom or a methyl group), in which each of 5% or more of the plurality of X's represents the structure represented by formula (2); Y represents a residue having such a structure that two amino groups are removed from a diamino compound; and n represents an average number of repeating units and is within the range from 1 to 100).　The polymeric compound represented by formula (1) has excellent solubility in a low-boiling-point solvent such as toluene. By using the polymeric compound represented by formula (1), it is possible to provide a cured article having flexibility sufficient for the formation of a film, having high adhesiveness to a low-roughness copper foil, having a low dielectric constant and a low dielectric loss tangent, and having a low linear expansion coefficient.

JPS6310628	PRODUCTION OF POLYANILINE
WO/2007/084797	CHEMICALLY MODIFIED POLYCATION POLYMER FOR SIRNA DELIVERY

AKATSUKA YASUMASA (JP)
HAYASHIMOTO SHIGEO (JP)

PCT/JP2022/045421

June 29, 2023

December 09, 2022

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NIPPON KAYAKU KK (JP)

C08G73/00; C08F290/14; C09J179/04

JP2006241300A	2006-09-14
JP2018059100A	2018-04-12
US20110152466A1	2011-06-23
JP2018016793A	2018-02-01
JP2018012748A	2018-01-25

KAMIMURA Yoichiro (JP)

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