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Title:
POLYMERIZABLE COMPOSITION, MOLDED BODY, AND COMPOSITE MEMBER
Document Type and Number:
WIPO Patent Application WO/2022/172446
Kind Code:
A1
Abstract:
The present disclosure provides a polymerizable composition capable of producing a molded body that can be repaired easily even if scratched and can have high hardness and a molded body that can be repaired easily even if scratched and can have high hardness. The polymerizable composition contains a polymerizable compound (A) and a metal ion (B). The polymerizable compound (A) contains a component (a) having a solubility parameter value range of within 2.0 in a proportion of 50-100 mol% (inclusive) relative to the polymerizable compound (A). The component (a) contains at least an unsaturated carboxylic acid (a1).

Inventors:
IWATA KOKI
IKOMA YOSHIMITSU
FUKUI KENICHIRO
Application Number:
PCT/JP2021/005511
Publication Date:
August 18, 2022
Filing Date:
February 15, 2021
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08F20/02
Foreign References:
JPH09194513A1997-07-29
JP2001277270A2001-10-09
JPH0827317A1996-01-30
JPH11246798A1999-09-14
JPH09111086A1997-04-28
JPH04122748A1992-04-23
JP2019061239A2019-04-18
JP2003064235A2003-03-05
JP2016138216A2016-08-04
JP2015120847A2015-07-02
JP2010116548A2010-05-27
JP2012031292A2012-02-16
JP2004099803A2004-04-02
JP2020121090A2020-08-13
JP2002080632A2002-03-19
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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