Title:
POLYMERIZABLE COMPOUND, ACTIVE ENERGY RAY-CURABLE RESIN COMPOSITION, CURED PRODUCT, COMPOSITION FOR RESIST, AND RESIST FILM
Document Type and Number:
WIPO Patent Application WO/2022/130921
Kind Code:
A1
Abstract:
Provided is a polymerizable compound that can be used in the formation of ultra-fine wiring patterns, due to having superior optical characteristics, etching tolerance, curability, solvent solubility, and similar, as well as superior infiltration into microscopic spaces. Specifically, provided is a polymerizable compound that is represented by general formula (1).
Inventors:
IMADA TOMOYUKI (JP)
NAGAE NORIO (JP)
NAGAE NORIO (JP)
Application Number:
PCT/JP2021/043093
Publication Date:
June 23, 2022
Filing Date:
November 25, 2021
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G59/14; C08F12/34; C08F299/02; G03F7/025; G03F7/027; G03F7/11
Domestic Patent References:
| WO2019017013A1 | 2019-01-24 | |||
| WO2021181958A1 | 2021-09-16 |
Foreign References:
| JP2000007758A | 2000-01-11 | |||
| JP2020117612A | 2020-08-06 | |||
| JP2007162027A | 2007-06-28 | |||
| JP2021008410A | 2021-01-28 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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