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Title:
POLYOXYMETHYLENE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/1994/000517
Kind Code:
A1
Abstract:
A polyoxymethylene composition which is improved in thermal stability, little stains the mold even in continuous long-term molding work, and is extremely reduced in the emission of a formaldehyde smell. The composition comprises polyoxymethylene, 0.01-5 wt. % of an antioxidant and 0.01-10 wt.% of a melamine-formaldehyde polycondensate, each based on the polyoxymethylene. The polycondensate to be used is one which is prepared by the reaction of mainly melamine and formaldehyde and contains on average 2.0-10 mol of melamine units per mole, and wherein 3 mol of the amino groups contained in 1 mol of melamine have on average at least 3.0 mol of hydrogen.

Inventors:
SUGIYAMA NORIYUKI (JP)
MIYAJI HIROYUKI (JP)
KAMIYA MAKOTO (JP)
CHISOKU ARISA (JP)
YAMAMOTO KAORU (JP)
Application Number:
PCT/JP1993/000901
Publication Date:
January 06, 1994
Filing Date:
June 30, 1993
Export Citation:
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Assignee:
POLYPLASTICS CO (JP)
SUGIYAMA NORIYUKI (JP)
MIYAJI HIROYUKI (JP)
KAMIYA MAKOTO (JP)
CHISOKU ARISA (JP)
YAMAMOTO KAORU (JP)
International Classes:
C08L59/00; C08L59/02; C08L61/28; C08L71/00; C08L75/04; (IPC1-7): C08L59/02; C08K5/10; C08K5/17
Foreign References:
JPS62119260A1987-05-30
JPS57111346A1982-07-10
JPS5015832A1975-02-19
Other References:
See also references of EP 0605736A4
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