Title:
POLYOXYMETHYLENE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/1996/012765
Kind Code:
A1
Abstract:
A polyoxymethylene resin composition composed of: (A) 50-99.9 parts by weight of a polyoxymethylene resin and (B) 50-0.1 part by weight of a polyolefin resin which is produced by using a single-site catalyst and has an ethylene unit content of 30-100 wt.% based on the polyolefin resin as a whole. It is excellent in low frictional properties and wear resistance at a temperature of as high as 60 �C or above.
Inventors:
NIINO MASAHIKO (JP)
IBE SADAO (JP)
IBE SADAO (JP)
Application Number:
PCT/JP1995/002160
Publication Date:
May 02, 1996
Filing Date:
October 20, 1995
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
NIINO MASAHIKO (JP)
IBE SADAO (JP)
NIINO MASAHIKO (JP)
IBE SADAO (JP)
International Classes:
C08L23/08; C08L59/00; C08L23/04; (IPC1-7): C08L59/00; C08L23/04; C08K3/38
Foreign References:
JPH073118A | 1995-01-06 | |||
JPS6333465A | 1988-02-13 | |||
JPS62253650A | 1987-11-05 | |||
JPS60144351A | 1985-07-30 | |||
JPS6086155A | 1985-05-15 | |||
JPS63284253A | 1988-11-21 |
Other References:
See also references of EP 0789055A4
Download PDF:
Previous Patent: BINDER FOR CELL AND COMPOSITION FOR ELECTRODE AND CELL PREPARED THEREFROM
Next Patent: PAPER-LIKE FILM
Next Patent: PAPER-LIKE FILM