Title:
POLYPHENYLENE ETHER RESIN COMPOSITION, PREPREG USING SAME, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/130735
Kind Code:
A1
Abstract:
One aspect of the present invention relates to a polyphenylene ether resin composition which contains (A) a modified polyphenylene ether compound that is terminally modified by a substituent which has a carbon-carbon unsaturated double bond and (B) a crosslinking-type curing agent that has two or more carbon-carbon unsaturated double bonds in each molecule, and which is characterized in that the modified polyphenylene ether compound (A) contains (A-1) a modified polyphenylene ether compound that has a specific structure and (A-2) a modified polyphenylene ether compound that has a specific structure.
Inventors:
UMEHARA HIROAKI
SUZUKI FUMITO
YASUMOTO JUN
INOUE HIROHARU
SUZUKI FUMITO
YASUMOTO JUN
INOUE HIROHARU
Application Number:
PCT/JP2018/038418
Publication Date:
July 04, 2019
Filing Date:
October 16, 2018
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08F299/02; B32B5/00; B32B15/08; B32B27/00; B32B27/26; C08G65/48; C08J5/24; H05K1/03
Domestic Patent References:
| WO2017067123A1 | 2017-04-27 |
Foreign References:
| CN107163244A | 2017-09-15 | |||
| JP2017128718A | 2017-07-27 | |||
| US20170174835A1 | 2017-06-22 | |||
| JP2016531959A | 2016-10-13 | |||
| JP2005292413A | 2005-10-20 |
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
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