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Patent Searching and Data


Title:
POLYPHENYLENE SULFIDE RESIN COMPOSITION AND DAMPING MATERIAL COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2022/030460
Kind Code:
A1
Abstract:
Provided is a polyphenylene sulfide resin composition having a high loss factor near 70 °C and a high loss factor in a wide range of temperatures. The polyphenylene sulfide resin composition comprises a polyphenylene sulfide resin (A) having a weight average molecular weight of greater than 4000 and a phenylene sulfide-based compound (B) having a weight average molecular weight of 4000 or less and including at least two phenylene sulfide structures, and has a glass transition temperature of 80 °C or less.

Inventors:
MURANO DAISUKE (JP)
MOKUDAI HARUKI (JP)
SUZUKI YOSHINORI (JP)
Application Number:
PCT/JP2021/028659
Publication Date:
February 10, 2022
Filing Date:
August 02, 2021
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Assignee:
KUREHA CORP (JP)
International Classes:
C08L81/02; C08K5/375; F16F7/00
Domestic Patent References:
WO2017022524A12017-02-09
Foreign References:
JPH055061A1993-01-14
JP2001172500A2001-06-26
JP2019119810A2019-07-22
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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