Title:
POLYSILSESQUIOXANE COMPOSITION AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/202800
Kind Code:
A1
Abstract:
The present invention provides a curable composition that can yield a cured product having excellent resistance to thermal decomposition and adhesiveness to a metal substrate. The present invention provides a polysilsesquioxane composition comprising a polysilsesquioxane and at least one compound selected from the group consisting of phosphorus-containing compounds, triazinethiol compounds, hydroxyl group-containing compounds having a boiling point of 230°C or higher, and carboxy group-containing compounds having a boiling point of 230°C or higher, wherein the phosphorus-containing compound is at least one compound selected from the group consisting of phosphine compounds, phosphate compounds, phosphinate compounds, and phosphonate compounds.
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Inventors:
NAKAMURA JUN-ICHI (JP)
MAEDA NOBUHIRO (JP)
MAEDA NOBUHIRO (JP)
Application Number:
PCT/JP2022/013113
Publication Date:
September 29, 2022
Filing Date:
March 22, 2022
Export Citation:
Assignee:
NIPPON CATALYTIC CHEM IND (JP)
International Classes:
C08K5/49; C08L83/04
Domestic Patent References:
| WO2013073606A1 | 2013-05-23 |
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Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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