Title:
POLYSTYRENE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/138199
Kind Code:
A1
Abstract:
Provided is a polystyrene resin composition comprising: (A) a polyamide; (B) a polystyrene resin having a syndiotactic structure; (C) a compatibilizing agent having a polar group which can react with the polyamide (A), and which is compatible with the polystyrene resin (B); (D) a hindered phenol compound; and (E) an inorganic filler. Of a total of 100% by weight of components (A) to (E), the polystyrene resin (B) accounts for 10.0% to 30.0% by weight, and the hindered phenol compound (D) accounts for 0.3% to 1.0% by weight.
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| JPH023435 | FORMABLE STYRENE RESIN PARTICLE AND PREPARATION THEREOF |
| WO/2013/077694 | RESIN MIXTURE |
| JPH078949 | [Title of Invention] Polyphenylene sulfide resin composition |
Inventors:
KONDO RYOSUKE (JP)
UCHIDA TAKAAKI (JP)
UCHIDA TAKAAKI (JP)
Application Number:
PCT/JP2019/050901
Publication Date:
July 02, 2020
Filing Date:
December 25, 2019
Export Citation:
Assignee:
IDEMITSU KOSAN CO (JP)
International Classes:
C08L25/04; C08K3/013; C08K3/40; C08K5/09; C08K5/20; C08K5/24; C08L77/00
Foreign References:
| JPH08319386A | 1996-12-03 | |||
| JPH08319385A | 1996-12-03 | |||
| JP2013119571A | 2013-06-17 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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