POLY(VINYLBENZYL)ETHER COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, CURABLE COMPOSITE MATERIAL, COMPOSITE MATERIAL CURED PRODUCT, LAMINATE, RESIN-EQUIPPED METAL FOIL, AND METHOD FOR PRODUCING POLY(VINYLBENZYL)ETHER COMPOUND

Title:

Document Type and Number:

WIPO Patent Application WO/2022/107624

Kind Code:

A1

Abstract:

Provided are: a poly(vinylbenzyl)ether compound that yields a cured product exhibiting heat resistance, low dielectric loss tangent, and high thermal conductivity; a method for producing said compound; a composition of said compound; and a cured product of said compound.　A poly(vinylbenzyl)ether compound represented by formula (1), wherein the poly(vinylbenzyl)ether compound is characterized in that 90% or more of the vinyl group substitution positions in vinylbenzyl moieties are para positions. R1 independently represent a hydrogen atom, a C1-12 alkyl group, or a vinylbenzyl group. The proportion of alkyl groups in all R1 is 0.1-40 mol%, and the proportion of vinylbenzyl groups is 60-99.9 mol%. R2 independently represent a C1-6 alkyl group, an allyl group, or a C6-12 aryl group. R3 independently represent a hydrogen atom or a C1-6 alkyl group. Ar1 and Ar2 represent C6-50 aromatic ring groups. The average value of n is within the range of 1-20. m is an integer of 0-6, r is an integer of 1-3, and m+r does not exceed 8. k is 0 or 1.

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Inventors:

SHIBATA YUKO (JP)
WASANO TSUGUTOSHI (JP)
IWASHITA SHINICHI (JP)

Application Number:

PCT/JP2021/040845

Publication Date:

May 27, 2022

Filing Date:

November 05, 2021

Export Citation:

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Assignee:

NIPPON STEEL CHEMICAL & MAT CO LTD (JP)

International Classes:

C08F12/34; B32B15/08; C08G61/02

Domestic Patent References:

WO2014103926A1	2014-07-03
WO2011033815A1	2011-03-24
WO2016104136A1	2016-06-30

Foreign References:

JP2005314556A	2005-11-10
JPH0543623A	1993-02-23
JP2015030776A	2015-02-16
JP2015067797A	2015-04-13
JP2019177688A	2019-10-17
JP2018184578A	2018-11-22
JP2004269590A	2004-09-30
JP2003332701A	2003-11-21

Attorney, Agent or Firm:

SASAKI Kazuya et al. (JP)

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