Title:
POROUS MATERIAL AND POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2016/185803
Kind Code:
A1
Abstract:
The problem to be solved by the present invention is to provide a porous material having a fine, uniform cell shape. The present invention pertains to a porous material characterized by being obtained by processing by a wet film-forming method a urethane resin composition containing a urethane resin (A) including 0.3-10 mol/kg of oxyethylene groups, obtained by reacting a polyol (a1) that includes a polyol (a1-1) having oxyethylene groups, a polyisocyanate (a2), and a chain extender (a3), and an organic solvent (B); and to a polishing pad characterized by being obtained by dressing the porous material. This porous material can be used suitably as a polishing pad and can be used especially suitably as a polishing pad for final finishing polishing.
Inventors:
MAEDA RYO (JP)
CHIJIWA HIROYUKI (JP)
CHIJIWA HIROYUKI (JP)
Application Number:
PCT/JP2016/060066
Publication Date:
November 24, 2016
Filing Date:
March 29, 2016
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08J9/28; B24B37/24; C08G18/48; C08J5/14; H01L21/304
Foreign References:
| JPS61155417A | 1986-07-15 | |||
| JP2002536461A | 2002-10-29 | |||
| JPS59179636A | 1984-10-12 | |||
| JPH02167349A | 1990-06-27 | |||
| JP2012223875A | 2012-11-15 | |||
| JP2011224702A | 2011-11-10 | |||
| JP2011073112A | 2011-04-14 |
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
河野 通洋 (JP)
河野 通洋 (JP)
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