POROUS PLATE-SHAPED FILLER, COATING COMPOSITION, HEAT-INSULATING FILM, AND HEAT-INSULATING FILM STRUCTURE

Title:

POROUS PLATE-SHAPED FILLER, COATING COMPOSITION, HEAT-INSULATING FILM, AND HEAT-INSULATING FILM STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2013/191263

Kind Code:

A1

Abstract:

Provided are a heat-insulating film and a heat-insulating film structure with improved heat-insulating effects. Further provided are a porous plate-shaped filler contained in the heat-insulating film and a coating composition for forming the heat-insulating film. In this heat-insulating film (3), porous plate-shaped fillers (1) are diposed dispersed in a matrix (3m) for binding the porous plate-shaped fillers (1). It is preferable for the heat-insulating film (3) to have the porous plate-shaped fillers (1) disposed (laminated) therein in a layered form. The porous plate-shaped filler (1) is in the shape of a plate with an aspect ratio of at least 3, with a shortest length of 0.1-50 µm and a porosity of 20-99%. The heat-insulating film (3) in which the porous plate-shaped fillers are used enables the heat transfer route to be longer and the thermal conductivity to be lower than a case of using spherical or cubical fillers.

Inventors:

TOMITA TAKAHIRO (JP)
HASHIMOTO SHIGEHARU (JP)
NISHIGAKI TAKU (JP)

Application Number:

PCT/JP2013/067006

Publication Date:

December 27, 2013

Filing Date:

June 20, 2013

Export Citation:

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Assignee:

NGK INSULATORS LTD (JP)

International Classes:

B32B7/022; B32B7/027; C08K7/24; C09D1/00; C09D7/61; C09D201/00

Foreign References:

JP2011122074A	2011-06-23
JP2004067500A	2004-03-04
JP2004043291A	2004-02-12
JP2006521463A	2006-09-21
JP2008506802A	2008-03-06
JP2005517620A	2005-06-16
JP2010500468A	2010-01-07
JPH09295872A	1997-11-18
JP2000044843A	2000-02-15
JP2008200922A	2008-09-04
JP2011052630A	2011-03-17

Other References: