POROUS POLISHING TOOL AND POLISHING TOOL INCLUDING SAME

Title:

POROUS POLISHING TOOL AND POLISHING TOOL INCLUDING SAME

Document Type and Number:

WIPO Patent Application WO/2017/149631

Kind Code:

A1

Abstract:

The objective of the invention is to provide a porous polishing tool with which the ratio between abrasive grains contacting an object being polished and a resin part contacting the object being polished can be maintained within a certain range during polishing, and with which a precise surface accuracy can be achieved without requiring complicated adjustments for stabilizing a device even in cases where a low-skill person uses the polishing tool by attaching the same to an automated device. This objective is achieved by a porous polishing tool comprising an anisotropically elastic foam body, a polymer, and abrasive grains.

Inventors:

FUJIWARA NORIMASA (JP)
MURAI KEIICHI (JP)

Application Number:

PCT/JP2016/056147

Publication Date:

September 08, 2017

Filing Date:

February 29, 2016

Export Citation:

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Assignee:

XEBEC TECH CO LTD (JP)

International Classes:

B24D3/32; B24D11/00

Foreign References:

JP2003175466A	2003-06-24
US3653859A	1972-04-04
JPS56126581A	1981-10-03
JP2002249030A	2002-09-03
JPH06158521A	1994-06-07
JP2010105102A	2010-05-13
JP2010105103A	2010-05-13
JP2010535643A	2010-11-25
JP2009215327A	2009-09-24

Other References: