Title:
POROUS POLYIMIDE FILM, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2023/120549
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a porous polyimide film which can be suitably used as an electrical insulating film, a frequency-selective film, or the like in a flexible substrate (FPC) or the like. In a method for producing a porous polyimide film according to the present invention, a polyamic acid solution is dried and then sintered to obtain the porous polyimide film, the polyamic acid solution comprising: (a) a polyamic acid which is obtained by polymerization reaction between an aromatic tetracarboxylic dianhydride containing at least a pyromellitic dianhydride and an aromatic diamine containing at least 4,4'-diaminodiphenyl ether; (b) an organic polar solvent which is a good solvent for the polyamic acid; and (c) a hydrophobic solvent which is a poor solvent for the polyamic acid, is dissolved in the organic polar solvent, is less likely to evaporate than the organic polar solvent at the same temperature and pressure, and has logP ranging from 4.00 to 6.00.
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Inventors:
MEZAKI FUJII MAKI (JP)
Application Number:
PCT/JP2022/046997
Publication Date:
June 29, 2023
Filing Date:
December 21, 2022
Export Citation:
Assignee:
IST CORP (JP)
International Classes:
C08J9/28; C08G73/10
Foreign References:
| JPH06293834A | 1994-10-21 | |||
| JP2015052061A | 2015-03-19 | |||
| JP2001224934A | 2001-08-21 |
Attorney, Agent or Firm:
KITAHARA Hiroyoshi et al. (JP)
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