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Patent Searching and Data


Title:
POROUS POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2022/230546
Kind Code:
A1
Abstract:
Provided is a porous polyimide film having an excellent gas permeation rate. The porous film is constituted from a porous material comprising either a polyimide resin or a polyimide resin composition including a polyimide resin and has gas permeability. At least one main surface of the porous film has a contact angle with water of 100° or greater or the at least one main surface has a content of fluorine atoms of 5 atm% or higher.

Inventors:
MORITA TAKAAKI (JP)
NISHIBATA MIKIO (JP)
HIKIMA TAKESHI (JP)
Application Number:
PCT/JP2022/015189
Publication Date:
November 03, 2022
Filing Date:
March 28, 2022
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
B01D71/64; B01D69/02; C08G73/10
Foreign References:
JPH0852332A1996-02-27
JP2018114491A2018-07-26
JPH119974A1999-01-19
JP2017127992A2017-07-27
JP2012115778A2012-06-21
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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