Title:
POROUS RESIN SHEET AND CARRIER TAPE
Document Type and Number:
WIPO Patent Application WO/2023/249024
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a porous resin sheet that suppresses the generation of paper dust and that can be shaped without being subjected to special steps such as heating and vacuuming; and a carrier tape using the porous resin sheet. The present invention pertains to a porous resin sheet comprising a porous resin layer that contains a thermoplastic resin. The thickness of the porous resin layer is 40-350 μm; the porosity of the porous resin layer is 35-80%; the porous resin layer includes a substrate layer and a first surface layer; the substrate layer and the first surface layer each contain a thermoplastic resin and particles; the content of the particles in the substrate layer is 20-45 mass%; and the content of the particles in the first surface layer is 45-80 mass%.
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Inventors:
HIROI YOSUKE (JP)
Application Number:
PCT/JP2023/022822
Publication Date:
December 28, 2023
Filing Date:
June 20, 2023
Export Citation:
Assignee:
YUPO CORP (JP)
International Classes:
B32B3/24; B32B7/02; B65D75/36; B65D85/86
Domestic Patent References:
WO2017188298A1 | 2017-11-02 |
Foreign References:
JP2001181423A | 2001-07-03 | |||
JP2002240204A | 2002-08-28 | |||
JPH06219466A | 1994-08-09 | |||
JPH0733162A | 1995-02-03 | |||
JPH08258173A | 1996-10-08 | |||
JP2007238822A | 2007-09-20 | |||
JPH02296840A | 1990-12-07 | |||
CN104029405A | 2014-09-10 | |||
US20130161231A1 | 2013-06-27 |
Attorney, Agent or Firm:
EIKOH, P.C. (JP)
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