Title:
POSITIONAL RELATIONSHIP MEASURING METHOD AND PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/195845
Kind Code:
A1
Abstract:
In this invention, the control device moves a cutting instrument relative to a material to be cut to cause the material to be cut and the cutting instrument to come into contact with each other (S10), and acquires coordinate values of a reference point at a time when the material to be cut and the cutting instrument have come into contact with each other (S12). The control device derives an error between the acquired coordinate values and the designed coordinate values of the reference point at a position where the material to be cut and the cutting instrument have come into contact with each other (S14), and outputs error information (S16).
Inventors:
SHAMOTO EIJI (JP)
Application Number:
PCT/JP2021/011349
Publication Date:
September 22, 2022
Filing Date:
March 19, 2021
Export Citation:
Assignee:
NATIONAL UNIV CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (JP)
International Classes:
G05B19/404; B23Q15/00; B23Q17/22
Foreign References:
| JPS61109646A | 1986-05-28 | |||
| KR101552879B1 | 2015-09-15 | |||
| JP2001105281A | 2001-04-17 | |||
| US4382215A | 1983-05-03 |
Attorney, Agent or Firm:
MORISHITA Sakaki (JP)
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