Title:
POSITIVE-ACTING PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/009732
Kind Code:
A1
Abstract:
A positive-acting photosensitive resin composition containing: a hydrophobic resin (A), which is an addition (co)polymer; an alkali-soluble resin (B) having a structural unit represented by formula (1); a quinone diazide compound (C); a fluorine-based surfactant (D); and a cresol novolak resin (In formula (1), x represents an integer of 0 to 3, each R1 independently represents a C1 to C5 alkyl group, and R2 represents an organic group having an alkali-soluble functional group).
Inventors:
ARAI YOSHIKAZU (JP)
TAKAHASHI AYAKO (JP)
TAKAHASHI AYAKO (JP)
Application Number:
PCT/JP2023/022421
Publication Date:
January 11, 2024
Filing Date:
June 16, 2023
Export Citation:
Assignee:
NIPPON POLYTECH CORP (JP)
International Classes:
G03F7/023; G03F7/004; H05B33/12; H05B33/22; H10K50/10
Domestic Patent References:
| WO2017069172A1 | 2017-04-27 | |||
| WO2020246517A1 | 2020-12-10 | |||
| WO2023080254A1 | 2023-05-11 |
Foreign References:
| JP2020126822A | 2020-08-20 | |||
| JP2008241741A | 2008-10-09 |
Attorney, Agent or Firm:
SAKAMOTO & PARTNERS (JP)
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