Title:
POSITIVE ELECTRODE FOR ELECTROLYTIC COPPER PLATING AND ELECTROLYTIC COPPER PLATING APPARATUS USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/026578
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a positive electrode for electrolytic copper plating with which plating characteristics such as plating facilitation and via-filling properties can be improved without increasing the complexity of the apparatus structure; and an electrolytic copper plating apparatus using the same. To achieve said purpose, a positive electrode for electrolytic copper plating that is to be disposed in an electrolysis tank in which an electrolytic copper plating solution is stored, is characterized in that: said electrolytic copper plating solution is an acidic electrolytic copper plating solution containing a disulfide compound; and said positive electrode is provided such that a soluble copper positive electrode and an insoluble positive electrode are electrically connected.
Inventors:
TSUKAHARA YOSHITO (JP)
SHIGEMATSU TOSHIYUKI (JP)
SHIGEMATSU TOSHIYUKI (JP)
Application Number:
PCT/JP2018/026178
Publication Date:
February 07, 2019
Filing Date:
July 11, 2018
Export Citation:
Assignee:
MELTEX INC (JP)
International Classes:
C25D17/10; C25D21/00; C25D21/12
Domestic Patent References:
| WO2017204246A1 | 2017-11-30 |
Foreign References:
| JP2014513211A | 2014-05-29 | |||
| JP2017008404A | 2017-01-12 |
Attorney, Agent or Firm:
YOSHIMURA, Katsuhiro (JP)
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