Title:
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, PATTERNED COATING FILM AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/225127
Kind Code:
A1
Abstract:
The present invention provides a positive photosensitive resin composition which stably enables the achievement of a good development contrast. The present invention is a positive photosensitive resin composition which contains: (A) a polyamic acid having a carboxyl group that is protected by a protecting group which is separated by the action of a base, a polyimide having a phenolic hydroxy group that is protected by a protecting group which is separated by the action of a base, or a polybenzoxazole precursor having a phenolic hydroxy group that is protected by a protecting group which is separated by the action of a base; and (B) a photobase generator that is obtained by rendering a basic compound, which has an acid dissociation constant pKa of 10.8 or more, latent by means of a covalent bond.
Inventors:
AKIMOTO MAHO (JP)
KUNITO MEI (JP)
OGATA TOSHIYUKI (JP)
ISHIKAWA NOBUHIRO (JP)
ARIMITSU KOJI (JP)
KUNITO MEI (JP)
OGATA TOSHIYUKI (JP)
ISHIKAWA NOBUHIRO (JP)
ARIMITSU KOJI (JP)
Application Number:
PCT/JP2021/017302
Publication Date:
November 11, 2021
Filing Date:
April 30, 2021
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
UNIV TOKYO SCIENCE FOUND (JP)
UNIV TOKYO SCIENCE FOUND (JP)
International Classes:
C08G73/10; C08G73/22; G03F7/004; G03F7/039; G03F7/20; G03F7/40
Foreign References:
| JP2019194631A | 2019-11-07 | |||
| JP2015066751A | 2015-04-13 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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