Title:
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING POLYIMIDE RESIN PATTERNS, AND PATTERNED POLYIMIDE RESIN FILM
Document Type and Number:
WIPO Patent Application WO/2014/065398
Kind Code:
A1
Abstract:
Provided is a positive photosensitive resin composition containing a polyimide resin that allows patterns to be satisfactorily formed by means of photolithography, and provides patterns with excellent heat resistance. Further provided is a method for forming polyimide resin patterns using the positive photosensitive resin composition. Further provided is a patterned polyimide resin film formed by means of the method for forming polyimide resin patterns. To the photosensitive resin composition are added, (A) a polyimide resin, and (B) a compound in which an imidazole compound having a specific structure is generated by the action of light.
Inventors:
NODA KUNIHIRO (JP)
CHISAKA HIROKI (JP)
SHIOTA DAI (JP)
CHISAKA HIROKI (JP)
SHIOTA DAI (JP)
Application Number:
PCT/JP2013/078946
Publication Date:
May 01, 2014
Filing Date:
October 25, 2013
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/039; G03F7/004; H01L21/027
Foreign References:
| JPH1172918A | 1999-03-16 | |||
| JP2007086763A | 2007-04-05 | |||
| JP2001066781A | 2001-03-16 | |||
| JP2003076013A | 2003-03-14 |
Other References:
See also references of EP 2913714A4
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki (JP)
Right wood Masayuki (JP)
Right wood Masayuki (JP)
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