Title:
POSITIVE RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD OF FORMING RESIST PATTERN
Document Type and Number:
WIPO Patent Application WO/2007/135836
Kind Code:
A1
Abstract:
A positive resist composition for immersion exposure which comprises a resin
ingredient (A) which comes to have enhanced alkali solubility by the action of
an acid and an acid generator ingredient (B) which generates an acid upon exposure
to light, wherein the resin ingredient (A) comprises a resin (A1) of the main-chain-cyclic
type containing fluorine atoms and having no acid-dissociable group and a resin
(A2) having a constituent unit (a) derived from acrylic acid and containing no
fluorine atom.
Inventors:
ENDO KOTARO (JP)
IRIE MAKIKO (JP)
IWAI TAKESHI (JP)
UTSUMI YOSHIYUKI (JP)
YOSHII YASUHIRO (JP)
NAKAMURA TSUYOSHI (JP)
IRIE MAKIKO (JP)
IWAI TAKESHI (JP)
UTSUMI YOSHIYUKI (JP)
YOSHII YASUHIRO (JP)
NAKAMURA TSUYOSHI (JP)
Application Number:
PCT/JP2007/058759
Publication Date:
November 29, 2007
Filing Date:
April 23, 2007
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
ENDO KOTARO (JP)
IRIE MAKIKO (JP)
IWAI TAKESHI (JP)
UTSUMI YOSHIYUKI (JP)
YOSHII YASUHIRO (JP)
NAKAMURA TSUYOSHI (JP)
ENDO KOTARO (JP)
IRIE MAKIKO (JP)
IWAI TAKESHI (JP)
UTSUMI YOSHIYUKI (JP)
YOSHII YASUHIRO (JP)
NAKAMURA TSUYOSHI (JP)
International Classes:
G03F7/039; G03F7/004; H01L21/027
Domestic Patent References:
| WO2007039346A2 | 2007-04-12 |
Foreign References:
| JP2006048029A | 2006-02-16 | |||
| JP2006071889A | 2006-03-16 | |||
| JP2005284238A | 2005-10-13 | |||
| JP2005351942A | 2005-12-22 | |||
| JP2007065024A | 2007-03-15 |
Attorney, Agent or Firm:
TANAI, Sumio et al. (Yaesu Chuo-ku Tokyo, 53, JP)
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