Title:
POSITIVE RESIST COMPOSITION AND METHOD FOR FORMATION OF RESIST PATTERN
Document Type and Number:
WIPO Patent Application WO/2008/053697
Kind Code:
A1
Abstract:
A positive resist composition comprising a resin component (A) whose alkali solubility can be increased by the action of an acid and an acid generator component (B) which can generate an acid upon being exposed to light, wherein the resin component (A) comprises a copolymer (A1) having a constituent unit (a1) represented by the general formula (II) or a polymer (A2) having a constituent unit (a1) represented by the general formula (II) [wherein R represents a hydrogen atom, a halogen atom, a lower alkyl group, or a halogenated lower alkyl group; and R1 to R3 independently represent an alkyl group, or a fluorinated alkyl group, provided that, in the fluorinated alkyl group, no fluorine atom is attached to a carbon atom adjacent to a tertiary carbon atom to which R1 to R3 are bonded, at least one of R1 to R3 represents the above-mentioned fluorinated alkyl group, and R2 and R3 may together form a ring structure.]
Inventors:
UTSUMI YOSHIYUKI (JP)
SHIMIZU HIROAKI (JP)
OHSHITA KYOKO (JP)
YOSHII YASUHIRO (JP)
SHIMIZU HIROAKI (JP)
OHSHITA KYOKO (JP)
YOSHII YASUHIRO (JP)
Application Number:
PCT/JP2007/070102
Publication Date:
May 08, 2008
Filing Date:
October 15, 2007
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
UTSUMI YOSHIYUKI (JP)
SHIMIZU HIROAKI (JP)
OHSHITA KYOKO (JP)
YOSHII YASUHIRO (JP)
UTSUMI YOSHIYUKI (JP)
SHIMIZU HIROAKI (JP)
OHSHITA KYOKO (JP)
YOSHII YASUHIRO (JP)
International Classes:
G03F7/039; H01L21/027
Foreign References:
| JP2004233953A | 2004-08-19 | |||
| JP2004361629A | 2004-12-24 | |||
| JP2006349800A | 2006-12-28 | |||
| JP2007155991A | 2007-06-21 |
Attorney, Agent or Firm:
TANAI, Sumio et al. (Yaesu Chuo-ku, Tokyo 53, JP)
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