POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

Title:

POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

Document Type and Number:

WIPO Patent Application WO/2006/126433

Kind Code:

A1

Abstract:

Disclosed is a positive resist composition containing a resin component (A) with an acid-cleavable dissolution inhibiting group whose alkali solubility is increased by the action of an acid, and an acid generator component (B) which generates an acid when exposed to light. The resin component (A) comprises a resin (A1) having a constitutional unit (a1) derived from a hydroxystyrene, a constitutional unit (a2) having an acid-cleavable dissolution inhibiting group, and a constitutional unit (a3) represented by the following general formula (a3-1). (a3-1) (In the formula, R represents a hydrogen atom, an alkyl group, a fluorine atom or a fluorinated alkyl group; R¹ represents a hydrogen atom or an acid-cleavable dissolution inhibiting group; A represents a single bond or a divalent organic group; and Ar represents an optionally substituted arylene group.)

Inventors:

TAKAYAMA TOSHIKAZU (JP)
FUJITA SHOICHI (JP)
MORI TAKAYOSHI (JP)
YONEMURA KOJI (JP)
SEO TAKEHITO (JP)

Application Number:

PCT/JP2006/309829

Publication Date:

November 30, 2006

Filing Date:

May 17, 2006

Export Citation:

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Assignee:

TOKYO OHKA KOGYO CO LTD (JP)
TAKAYAMA TOSHIKAZU (JP)
FUJITA SHOICHI (JP)
MORI TAKAYOSHI (JP)
YONEMURA KOJI (JP)
SEO TAKEHITO (JP)

International Classes:

G03F7/039; H01L21/027

Foreign References:

JP2004302434A	2004-10-28
JP2003322970A	2003-11-14
JP2004085921A	2004-03-18
JPH10228113A	1998-08-25
JP2005309097A	2005-11-04

Attorney, Agent or Firm:

Tanai, Sumio (Yaesu Chuo-k, Tokyo 53, JP)

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