POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE EACH COMPRISING THE CURED FILM

Title:

POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE EACH COMPRISING THE CURED FILM

Document Type and Number:

WIPO Patent Application WO/2009/136647

Kind Code:

A1

Abstract:

Disclosed is a positive-type photosensitive resin composition which is characterized by comprising (A) an alkali-soluble resin, (B) a photosensitizing agent, and (C) a silicon compound represented by general formula (1) [wherein R1 represents an alkylene group having 5 to 30 carbon atoms, or an organic group having at least one aromatic ring; and R2 represents an alkyl group having 1 to 10 carbon atoms]. The positive-type photosensitive resin can be produced into a coating film having excellent adhesion after an image development process or a cured film having excellent adhesion to a substrate after a humidity treatment, and has excellent storage stability.

Inventors:

SUGIYAMA HIROMICHI (JP)
TAKAHASHI YASUNORI (JP)

Application Number:

PCT/JP2009/058728

Publication Date:

November 12, 2009

Filing Date:

April 28, 2009

Export Citation:

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Assignee:

SUMITOMO BAKELITE CO (JP)
SUGIYAMA HIROMICHI (JP)
TAKAHASHI YASUNORI (JP)

International Classes:

G03F7/075; C08G69/26; G03F7/023

Domestic Patent References:

WO2007004345A1

2007-01-11

Foreign References:

JPH1010740A	1998-01-16
JP2000347401A	2000-12-15
JPH10217421A	1998-08-18
JP2003531942A	2003-10-28
JPH0146862B2	1989-10-11

Other References: