Title:
POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/080992
Kind Code:
A1
Abstract:
Disclosed is a positive-type photosensitive resin composition which has excellent storage stability, particularly excellent sensitivity stability, and can be formed into a cured film having excellent adhesion onto a substrate when heated at 350˚C or higher or heated in the air.
The positive-type photosensitive resin composition comprises (a) a polymer having, as the main component, at least one structure selected from the group consisting of a polyimide precursor structure, a polybenzoxazole precursor structure, and a polyimide structure, (b) a quinonediazide compound, (c) a silane coupling agent having a styryl group, (d) a silane coupling agent having an epoxy group, an oxetanyl group, a methacryloxy group, an acryloxy group, an amino group, an amide group or mercapto group and an alkoxysilyl group, and (e) a solvent.
Inventors:
MIYABE TOMOTSUGU (JP)
FUJITA YOJI (JP)
FUJITA YOJI (JP)
Application Number:
PCT/JP2010/071888
Publication Date:
July 07, 2011
Filing Date:
December 07, 2010
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
MIYABE TOMOTSUGU (JP)
FUJITA YOJI (JP)
MIYABE TOMOTSUGU (JP)
FUJITA YOJI (JP)
International Classes:
G03F7/023; C08G73/10; C08G73/22; G03F7/075; H01L21/027
Foreign References:
| JP2008083124A | 2008-04-10 | |||
| JP2008191574A | 2008-08-21 | |||
| JP2009192851A | 2009-08-27 | |||
| JP2004124054A | 2004-04-22 | |||
| JP2008083124A | 2008-04-10 | |||
| JP2005043883A | 2005-02-17 |
Other References:
See also references of EP 2520977A4
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