POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PARTITION WALL, AND OPTICAL ELEMENT

Title:

POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PARTITION WALL, AND OPTICAL ELEMENT

Document Type and Number:

WIPO Patent Application WO/2024/038814

Kind Code:

A1

Abstract:

The present invention pertains to a positive-type photosensitive resin composition which contains an alkali-soluble resin (A), a photosensitizer (B), and an ink repellent agent (C), and in which the ink repellent agent (C) has a monovalent group that is represented by formula (c) and that has 2-40 carbon atoms.　(c): Rf1-O-Rf2- [Rf1 represents a polyfluoro alkyl group having 1-6 carbon atoms, and Rf2 represents a polyfluoro alkylene group optionally having an etheric oxygen atom between carbon-carbon atoms (however, Rf1-O-Rf2- has at least one -O-CF2-group).]

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Inventors:

KAWASHIMA MASAYUKI (JP)
TAKAHASHI HIDEYUKI (JP)

Application Number:

PCT/JP2023/029118

Publication Date:

February 22, 2024

Filing Date:

August 09, 2023

Export Citation:

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Assignee:

AGC INC (JP)

International Classes:

G03F7/023; G02B5/20; G03F7/004; H05B33/12; H05B33/22; H10K50/10

Domestic Patent References:

WO2013133392A1

2013-09-12

Foreign References:

JP2007163756A	2007-06-28
JP2005036160A	2005-02-10
JP2021135499A	2021-09-13

Attorney, Agent or Firm:

EIKOH, P.C. (JP)

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