Title:
POTTING AGENT FOR SEPARATION MEMBRANE MODULE AND SEPARATION MEMBRANE MODULE
Document Type and Number:
WIPO Patent Application WO/2023/054205
Kind Code:
A1
Abstract:
The present invention mainly addresses the problem of providing: a potting agent for manufacturing a separation membrane module having excellent resistance to a highly soluble organic solvent; and a separation membrane module obtained by using the potting agent. A potting agent for a separation membrane module according to the present invention contains an epoxy compound and an imidazole compound.
Inventors:
MASAKI TATSUNORI (JP)
INOUE KUNIKO (JP)
MAEDA KEISUKE (JP)
INOUE KUNIKO (JP)
MAEDA KEISUKE (JP)
Application Number:
PCT/JP2022/035514
Publication Date:
April 06, 2023
Filing Date:
September 22, 2022
Export Citation:
Assignee:
UNITIKA LTD (JP)
International Classes:
B01D63/00; B01D71/56
Domestic Patent References:
| WO2021085037A1 | 2021-05-06 |
Foreign References:
| JPH06319960A | 1994-11-22 | |||
| JPS58166902A | 1983-10-03 |
Attorney, Agent or Firm:
TANAKA, Junya et al. (JP)
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