Title:
POTTING MOLD, POTTING APPARATUS, AND POTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/169205
Kind Code:
A1
Abstract:
Disclosed are a potting mold, potting apparatus, and potting method, relating to the technical field of electric motor manufacturing. The potting mold is used for potting adhesive on a mover module, the mover module comprising a sliding platform and a mover assembly fixedly connected to the sliding platform; the potting mold comprises a mold body; the mold body is formed having an accommodating cavity having one end open; said accommodating cavity is used for fitting with the sliding platform such that the mover assembly is accommodated in the accommodating cavity, and the sliding platform covers the open end to form a potting cavity together with the mold body. The technical solution provided by the present invention aims to solve the problem of poor assembly accuracy of a mover module caused by existing potting processes.
Inventors:
LIU YUANJIANG (CN)
HE ZIHE (CN)
HE ZIHE (CN)
Application Number:
PCT/CN2020/111170
Publication Date:
September 02, 2021
Filing Date:
August 26, 2020
Export Citation:
Assignee:
GOERTEK INC (CN)
International Classes:
B29C39/10; H02K15/12; B29C39/24; B29C39/26; H02K15/02
Foreign References:
| CN111319176A | 2020-06-23 | |||
| CN207573203U | 2018-07-03 | |||
| CN208461662U | 2019-02-01 | |||
| CN209389880U | 2019-09-13 | |||
| CN209030068U | 2019-06-25 | |||
| CN108539952A | 2018-09-14 | |||
| US20060218777A1 | 2006-10-05 |
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