Title:
POWDER FOR CLAY-LIKE COMPOSITION FOR FORMING SINTERED SILVER-COPPER ALLOY OBJECT USING COPPER COMPOUND, CLAY-LIKE COMPOSITION, AND METHOD FOR PRODUCING CLAY-LIKE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/031765
Kind Code:
A1
Abstract:
Powder for a clay-like composition for forming a sintered silver-copper alloy object, the powder being a powder component containing silver-containing powder and powder of a copper compound, wherein the powder of a copper compound contains a compound that changes to copper oxide at 550°C or lower.
Inventors:
YAMAMOTO YOSHIFUMI (JP)
YAMAJI TAKASHI (JP)
IDO YASUO (JP)
OTANI SHINJI (JP)
YAMAJI TAKASHI (JP)
IDO YASUO (JP)
OTANI SHINJI (JP)
Application Number:
PCT/JP2012/071695
Publication Date:
March 07, 2013
Filing Date:
August 28, 2012
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
YAMAMOTO YOSHIFUMI (JP)
YAMAJI TAKASHI (JP)
IDO YASUO (JP)
OTANI SHINJI (JP)
YAMAMOTO YOSHIFUMI (JP)
YAMAJI TAKASHI (JP)
IDO YASUO (JP)
OTANI SHINJI (JP)
International Classes:
B22F1/00; A44C9/00; A44C27/00; C22C1/05; C22C5/06; C22C32/00
Domestic Patent References:
| WO2009009710A2 | 2009-01-15 | |||
| WO2011125244A1 | 2011-10-13 |
Foreign References:
| JPH05263103A | 1993-10-12 | |||
| JP2006183076A | 2006-07-13 | |||
| JP2002356702A | 2002-12-13 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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Claims:
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