Title:
POWDER FOR DEPOSITION MODELING, SLURRY FOR DEPOSITION MODELING, THREE-DIMENSIONAL DEPOSITION MODEL, SINTERED BODY, METHOD FOR PRODUCING SLURRY FOR DEPOSITION MODELING, DEPOSITION MODELING METHOD AND SINTERING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/002040
Kind Code:
A1
Abstract:
A powder (10) for deposition modeling according to the present invention is composed of an inorganic coarse powder (1) and an inorganic fine powder (2) that has a smaller average particle diameter than the inorganic coarse powder (1); and the particle diameter volume ratio of the inorganic coarse powder (1) to the inorganic fine powder (2) is from 28.0 to 53.0.
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Inventors:
BONO TAKUMI (JP)
TANIGAWA SHUJI (JP)
OGUMA HIDETAKA (JP)
TSUBOTA SHUHO (JP)
TANIGAWA SHUJI (JP)
OGUMA HIDETAKA (JP)
TSUBOTA SHUHO (JP)
Application Number:
PCT/JP2020/003453
Publication Date:
January 07, 2021
Filing Date:
January 30, 2020
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B28B1/30; B33Y10/00; B33Y40/00; B33Y70/00; B33Y80/00; C04B35/14
Domestic Patent References:
WO2017104234A1 | 2017-06-22 |
Foreign References:
JP2018066049A | 2018-04-26 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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