POWDER SURFACE TREATMENT APPARATUS AND POWDER SURFACE TREATMENT METHOD

WIPO Patent Application WO/2011/010620

A1

Disclosed are a novel powder surface treatment apparatus and a novel powder surface treatment method, both of which enable the surfaces of powder particles to be treated within a short period and with high efficiency. The powder surface treatment apparatus comprises: a container (20) into which a liquid (30) is to be filled; a first electrode (40) which is placed a predetermined distance away from the surface of the liquid; a second electrode which is so arranged as to be electrically connected to the liquid (30) when the liquid (30) is filled in the container; and an electrical power source (50) which is connected to the first and second electrodes. The powder surface treatment apparatus is characterized by being so adapted that the liquid (30) is filled, powder (P) to be treated is placed on the surface of the liquid, and a voltage is then applied to the first and second electrodes, thereby causing the generation of plasma in a space between the first electrode and the surface of the liquid.

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JP6009947	Nanoparticle manufacture device
WO/2003/089155	METHOD AND DEVICE FOR HARDENING A COATING

TAGUCHI KOHSHI (JP)

PCT/JP2010/062111

January 27, 2011

July 16, 2010

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SAKIGAKE SEMICONDUCTOR CO LTD (JP)
TAGUCHI KOHSHI (JP)

B01J19/08; B01J2/00

JPH06134296A	1994-05-17
JP2003300716A	2003-10-21
JP2006216468A	2006-08-17
JP2005274058A	2005-10-06

MORIWAKI, Masashi et al. (JP)
Masashi Moriwaki (JP)

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