Title:
POWDERY SOYBEAN MATERIAL AND WHEAT FLOUR PRODUCTS USING SAME
Document Type and Number:
WIPO Patent Application WO/2011/004893
Kind Code:
A1
Abstract:
Provided is a novel powdery soybean material which is to be used in wheat flour products. When the novel powdery soybean material is used in coating material for deep-fried food including tempura (vegetables or fish dipped in batter and deep-fried) and lightly dredged deep-fried food, an improved coating which has excellent texture and can keep the excellent texture for a long time can be formed. Further, the novel powdery soybean material can protein-fortify bakery products without impairing the physical properties of dough.
A powdery soybean material which is characterized by having a crude protein content of 50 to 65wt% in terms of dry solid matter, an insoluble dietary fiber content of 2 to 10wt%, and a nitrogen solubility index (NSI) of 50 or less.
Inventors:
SAITO YUTAKA (JP)
NAKAMURA YASUSHI (JP)
NAKAMURA YASUSHI (JP)
Application Number:
PCT/JP2010/061702
Publication Date:
January 13, 2011
Filing Date:
July 09, 2010
Export Citation:
Assignee:
FUJI OIL CO LTD (JP)
SAITO YUTAKA (JP)
NAKAMURA YASUSHI (JP)
SAITO YUTAKA (JP)
NAKAMURA YASUSHI (JP)
International Classes:
A23J3/16; A21D2/36; A23L7/10; A23L7/157; A23L11/00
Foreign References:
| EP2005836A2 | 2008-12-24 | |||
| JPH0994068A | 1997-04-08 | |||
| JP2003135014A | 2003-05-13 | |||
| JPS5925650A | 1984-02-09 | |||
| JP2000083595A | 2000-03-28 | |||
| JPH08266239A | 1996-10-15 |
Other References:
PABLO D RIBOTTA ET AL.: "Effect of soybean addition on the rheological properties and breadmaking quality of wheat flour", JOURNAL OF THE SCIENCE OF FOOD AND AGRICULTURE, vol. 85, no. 11, 3 August 2005 (2005-08-03), pages 1889 - 1896
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