POWER CONVERSION DEVICE

Title:

POWER CONVERSION DEVICE

Document Type and Number:

WIPO Patent Application WO/2022/202248

Kind Code:

A1

Abstract:

This power conversion device comprises a semiconductor element, and a first substrate and a second substrate that are arranged facing each other. The first substrate has a first main surface facing the second substrate, and a first auxiliary surface on the reverse side of the first main surface. The second substrate has a second main surface facing the first substrate, and a second auxiliary surface on the reverse side of the second main surface. A first conductor exposed at the first auxiliary surface is embedded in the first substrate, and a second conductor exposed at the second auxiliary surface is embedded in the second substrate. The semiconductor element is arranged between the first and second conductors. The semiconductor element is electrically connected to the first and second conductors.

Inventors:

ASAI KYOTA (JP)
TOKUYAMA TAKESHI (JP)
NAMBA AKIHIRO (JP)

Application Number:

PCT/JP2022/009687

Publication Date:

September 29, 2022

Filing Date:

March 07, 2022

Export Citation:

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Assignee:

HITACHI LTD (JP)

International Classes:

H02M7/48; H01L23/12; H01L23/36; H01L25/07; H01L25/18

Foreign References:

JP2019096771A	2019-06-20
JP2017069253A	2017-04-06
JP2002246515A	2002-08-30
JP2006229180A	2006-08-31