Title:
POWER CONVERSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/243167
Kind Code:
A1
Abstract:
A power conversion device according to the present invention comprises a semiconductor device and a wiring board. The wiring board has a through-hole, and a portion of an insulating resin and a heat spreader of the semiconductor device are disposed so as to pass through the through-hole and protrude to the other side of the wiring board. The semiconductor device has a flange section. A gap between the inner circumferential surface of the through-hole and the insulating resin of the semiconductor device inside the through-hole and/or a gap between one side of the wiring board and the flange section is filled with a first resin material, and a second resin material covering at least a connection portion between an external terminal and a power wiring layer is coated onto the one side of the wiring board.
Inventors:
KUSUKAWA JUNPEI (JP)
IDE EIICHI (JP)
IDE EIICHI (JP)
Application Number:
PCT/JP2023/010450
Publication Date:
December 21, 2023
Filing Date:
March 16, 2023
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
H02M7/48
Domestic Patent References:
| WO2013065316A1 | 2013-05-10 | |||
| WO2014175062A1 | 2014-10-30 |
Foreign References:
| JP2012043875A | 2012-03-01 | |||
| JP2009081246A | 2009-04-16 |
Attorney, Agent or Firm:
SUNNEXT INTERNATIONAL PATENT OFFICE (JP)
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