Title:
POWER CONVERTER, SERVICE LIFE DIAGNOSIS DEVICE FOR SEMICONDUCTOR CHIP, AND METHOD FOR DIAGNOSING SERVICE LIFE OF SEMICONDUCTOR CHIP
Document Type and Number:
WIPO Patent Application WO/2020/250445
Kind Code:
A1
Abstract:
This power converter (1) is equiped with a plurality of semiconductor chips mounted to constituent members by soldering, and controls the operation of one or more bridge circuits containing at least one series circuit electrically connecting in series a first semiconductor chip (IGBT(P)) and a second semiconductor chip (IGBT(P)) from the plurality of semiconductor chips to one another. The power converter (1) measures the electrical characteristics of the first and second semiconductor chips (IGBT(P) and IGBT(N)) in a state of being mounted to the actual machine, and calculates the thermal resistance of the heat-dissipating structure which includes the constituent members on the basis of the measured electrical characteristics. The power converter (1) diagnoses abnormalities or service life by deterioration in the first and second semiconductor chips (IGBT(P) and (IGBT(N)) by comparing the calculated thermal resistance with initial values.
Inventors:
OKUMURA NORIHIKO (JP)
Application Number:
PCT/JP2019/023754
Publication Date:
December 17, 2020
Filing Date:
June 14, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H02M7/48
Foreign References:
| JP2019047641A | 2019-03-22 | |||
| JP2012135119A | 2012-07-12 | |||
| JP2006254574A | 2006-09-21 | |||
| JP2017184298A | 2017-10-05 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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