POWER ELECTRONIC ASSEMBLY INTEGRATED STRUCTURE

WIPO Patent Application WO/2020/047940

A1

Disclosed is a power electronic assembly integrated structure, comprising: a capacitor and an integrated module, wherein the capacitor comprises a body (1) and an accommodation cavity (2) arranged inside the body (1); and the integrated module comprises multiple layers of integrated sub-modules stacked inside the accommodation cavity (2), and the integrated sub-module comprises a signal input node located in a central portion of the accommodation cavity (2) and multiple sub-loops (3) connected between the signal input node and the body (1). The accommodation cavity (2) is arranged inside the body (1) of the capacitor, and multiple layers of integrated sub-modules are arranged inside the accommodation cavity (2), wherein the integrated sub-module comprises a signal input node located in a central portion of the accommodation cavity (2) and multiple sub-loops (3) connected between the signal input node and the body (1), such that the voltage overshoot occurring when a power electric device is switched on and switched off and the nonuniformity of a switching current are reduced, thereby greatly increasing a safety working range of a device and improving the safe reliability thereof.

WO/2000/040408	METHOD OF MASS PRODUCING AND PACKAGING INTEGRATED OPTICAL SUBSYSTEMS
WO/2003/028418	THIN FILM CIRCUIT BOARD DEVICE AND ITS MANUFACTURING METHOD
JPS5645069	HYBRID INTEGRATED CIRCUIT DEVICE

DONG ZHILIANG (CN)

PCT/CN2018/109553

March 12, 2020

October 10, 2018

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DONG ZHILIANG (CN)

H01L25/16; H01L23/538

CN208796995U	2019-04-26
CN105932016A	2016-09-07
CN204792787U	2015-11-18
CN103560015A	2014-02-05
CN101483097A	2009-07-15
US5544035A	1996-08-06

HEFEI XINGDONG INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)

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