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Patent Searching and Data


Title:
POWER MODULE AND POWER CONVERTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/130989
Kind Code:
A1
Abstract:
Provided is a power module with which thermal resistance from a semiconductor element to a base plate is reduced and stress relaxation of a joining part is achieved. This power module comprises: a semiconductor element (1); an insulating substrate (11) having an insulating layer (5) and provided with circuit layers (3, 7) on the upper surface of the insulating layer (5) and metal layers (4, 6) on the lower surface of the insulating layer (5); and a sintering joining member (2) that joins the rear surface of the semiconductor element (1) and the upper surface of the circuit layer (3) on the upper surface side of the insulating layer (5), and that has an upper surface larger than the outer circumference on the rear surface side of the semiconductor element (1).

Inventors:
YOKOYAMA YOSHINORI (JP)
NEGISHI TETSU (JP)
YAMAZAKI KOJI (JP)
Application Number:
PCT/JP2019/051238
Publication Date:
July 01, 2021
Filing Date:
December 26, 2019
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/29; H01L21/52; H01L23/40; H01L25/07; H01L25/18
Domestic Patent References:
WO2019087920A12019-05-09
WO2017090267A12017-06-01
WO2013021750A12013-02-14
Foreign References:
JP2019175989A2019-10-10
US20120306087A12012-12-06
JP2019033131A2019-02-28
JP2018129352A2018-08-16
JP2015185559A2015-10-22
Attorney, Agent or Firm:
MURAKAMI, Kanako et al. (JP)
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