Title:
POWER MODULE, ELECTRICAL DEVICE COMPRISING AT LEAST ONE SUCH POWER MODULE, AND METHOD FOR PRODUCING A POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2022/033806
Kind Code:
A3
Abstract:
The invention relates to a power module (1) comprising: an electrically insulating layer (2); a first electrically conductive layer (3) which is arranged on the electrically insulating layer (2) (and can be part of a DCB or IMS substrate); a first solder layer (4) which is arranged on the first electrically conductive layer (3); and at least one power component (5), which in each case is arranged on the first solder layer (4), wherein a first spacer (6) is arranged in each case between the respective power component (5) and the first electrically conductive layer (3) or between the power component (5) and the electrically insulating layer (2). Alternatively, a power module (1) comprises: a base plate (15); a second solder layer (14) which is arranged on the base plate (15); a second electrically conductive layer (13) which is arranged on the second solder layer (14); an electrically insulating layer (2) which is arranged on the second electrically conductive layer (13); a first electrically conductive layer (3) which is arranged on the electrically insulating layer (2) (the two electrically conductive layers (3, 13) and the electrically insulating layer (2) can be in the form of a DCB or IMS substrate); a first solder layer (4) which is arranged on the first electrically conductive layer (3); and at least one power component (5) which in each case is arranged on the first solder layer (4), and at least one second spacer (16) is arranged in each case between the base plate (15) and the second electrically conductive layer (13). In order to create, inter alia, a cost-effective power module (1), the respective electrically conductive layer (3, 13) has at least one recess (8, 18) in the surroundings of the respective spacer (6, 16) and the respective spacer (6, 16) is designed in the form of at least one projection (9, 19) extending from the respective electrically conductive layer (3, 13). The power module (1) can also have both the first and the second spacer (6, 16). The respective spacer (6, 16) and the respective electrically conductive layer (3, 13) can be in one piece. In each spacer (6, 16), the at least one recess (8, 18) can have substantially the same volume as the at least one projection (9, 19). The respective spacer (6, 16) can be produced by forming the respective electrically conductive layer (3, 13), for example by plastic deformation, in particular by applying pressure to the respective electrically conductive layer (3, 13) or by introducing a notch (e.g. by means of a chisel) in the respective electrically conductive layer (3, 13). The respective recess (8, 18) can be annular or cylindrical and the respective projection (9, 19) can be cylindrical or annular, and the respective annular or cylindrical recess (8, 18) can be introduced into the electrically conductive layer (3, 13) in particular by means of an annular or cylindrical punch which forms the respective cylindrical or annular projection (9, 19) in the respective electrically conductive layer (3, 13). The respective spacer (6, 16) can be formed by partially removing the respective electrically conductive layer (3, 13), in particular by etching or milling. Alternatively, the respective spacer (6, 16) can be additively formed on the respective electrically conductive layer (3, 13), the respective spacer (6, 16) containing solderable material, material that is coated with a solderable material, bond wire, copper, copper paste and/or silver and/or the respective spacer (6, 16) can be formed by 3D printing, by a coating method, in particular cold gas spraying, or by screen printing. An electrical device (10), in particular an inverter, can have at least one power module (1) of this kind. Thanks to the respective spacer (6, 16), the thickness of the respective soldering layer (4, 14) can be optimized such that it has good electrical and thermal conductivity and can compensate for stresses due to thermal expansion, thereby preventing crack formation and embrittlement of the respective solder layer (4, 14).
Inventors:
KNEISSL PHILIPP (DE)
KÜRTEN BERND (DE)
NAMYSLO LUTZ (DE)
KÜRTEN BERND (DE)
NAMYSLO LUTZ (DE)
Application Number:
PCT/EP2021/070006
Publication Date:
November 17, 2022
Filing Date:
July 16, 2021
Export Citation:
Assignee:
SIEMENS AG (DE)
International Classes:
H01L23/488; H01L21/48; H01L21/60; H01L23/373
Foreign References:
| JP2010165764A | 2010-07-29 | |||
| US20160113107A1 | 2016-04-21 | |||
| JP2007116080A | 2007-05-10 | |||
| JP2000277876A | 2000-10-06 |
Download PDF: