Title:
POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2014/103955
Kind Code:
A1
Abstract:
This power module has: a copper layer comprising copper or a copper alloy, provided on a circuit layer (12) surface bonded to a semiconductor element (3); and a soldered layer (20) formed by using a solder material and formed between the circuit layer (12) and the semiconductor element (3). An alloy layer (21) containing Sn as the main component thereof and also containing 0.5-10 mass% Ni and 30-40 mass% Cu is formed in the interface between the soldered layer (20) and the circuit layer (12). The thickness of this alloy layer (21) is set in the range of 2-20 µm, and has a thermal resistance increase rate of no more than 10% in a power cycle test in which the power cycle under conditions of a temperature difference of 80°C and a conduction duration of 5 s is set to a load of 100,000 times.
Inventors:
OHASHI TOUYOU (JP)
NAGATOMO YOSHIYUKI (JP)
NAGASE TOSHIYUKI (JP)
KUROMITSU YOSHIROU (JP)
NAGATOMO YOSHIYUKI (JP)
NAGASE TOSHIYUKI (JP)
KUROMITSU YOSHIROU (JP)
Application Number:
PCT/JP2013/084329
Publication Date:
July 03, 2014
Filing Date:
December 20, 2013
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L21/52; B23K35/26; C22C13/00
Foreign References:
| JP2005116963A | 2005-04-28 | |||
| JP2006289434A | 2006-10-26 | |||
| JP2008098212A | 2008-04-24 | |||
| JP2011143442A | 2011-07-28 | |||
| JP2002076551A | 2002-03-15 | |||
| JP2008227336A | 2008-09-25 | |||
| JP2004172378A | 2004-06-17 |
Other References:
See also references of EP 2940720A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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