Title:
POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2016/108261
Kind Code:
A1
Abstract:
A power module (PM) is provided with a power semiconductor element (4), a wiring member (2), a circuit substrate (6), an external terminal (8), junction members (5, 7), and a sealing resin (1). A gap (3) is formed continuously from an edge surface of the junction member (5) located between the power semiconductor element (4) and the wiring member (2) to a portion of the surface of the wiring member (2), the portion being located between the edge surface of the junction member and a prescribed location on the wiring member (2) that is at a distance from the edge surface of the junction member, the gap being formed between the sealing resin (1), and the edge surface of the junction member (5) and the surface of the wiring member (2).
Inventors:
FUKUMOTO AKIHISA (JP)
NEGISHI TETSU (JP)
YAMAMOTO KEI (JP)
SHINOHARA TOSHIAKI (JP)
NISHIKAWA KAZUYASU (JP)
NEGISHI TETSU (JP)
YAMAMOTO KEI (JP)
SHINOHARA TOSHIAKI (JP)
NISHIKAWA KAZUYASU (JP)
Application Number:
PCT/JP2015/077470
Publication Date:
July 07, 2016
Filing Date:
September 29, 2015
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L25/07; H01L23/29; H01L23/48; H01L25/18
Foreign References:
| JP2006179655A | 2006-07-06 | |||
| JP2012238796A | 2012-12-06 | |||
| JP2014099487A | 2014-05-29 | |||
| US20080308924A1 | 2008-12-18 | |||
| JP2010232365A | 2010-10-14 |
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
Patent business corporation Fukami patent firm (JP)
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