Title:
POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2021/230621
Kind Code:
A1
Abstract:
The present invention relates to a power module comprising: a housing (100) which has a vertically open empty space formed in the middle; a heat dissipating plate (500), the edge of which is bonded to the bottom surface of the housing (100) and the top surface of which is exposed through the empty space of the housing (100); a lower ceramic board (200) bonded to the top surface of the heat dissipating plate (500); an upper ceramic board (300) disposed above the lower ceramic board (200) and having a semiconductor chip (G) mounted to the bottom surface; and a PCB board (400) disposed above the upper ceramic board (300). The present invention has advantages in that stepped portions in the heat dissipating plate make it easy to adjust the distances between internal components mounted to the board, when required, and the heat dissipating performance can be enhanced by increasing the thickness of portions requiring superior heat dissipating performance.
Inventors:
KIM JONGUK (KR)
BIN JINHYUCK (KR)
CHO TAEHO (KR)
YEO INTAE (KR)
PARK SEUNGGON (KR)
BIN JINHYUCK (KR)
CHO TAEHO (KR)
YEO INTAE (KR)
PARK SEUNGGON (KR)
Application Number:
PCT/KR2021/005883
Publication Date:
November 18, 2021
Filing Date:
May 11, 2021
Export Citation:
Assignee:
AMOSENSE CO LTD (KR)
International Classes:
H01L23/373; H01L23/04; H01L23/06; H01L23/367; H01L23/492; H05K7/20
Foreign References:
| KR20110009729U | 2011-10-13 | |||
| KR20190110376A | 2019-09-30 | |||
| KR200199511Y1 | 2001-01-15 | |||
| KR20160035704A | 2016-04-01 | |||
| KR20180097021A | 2018-08-30 | |||
| US20190206757A1 | 2019-07-04 |
Attorney, Agent or Firm:
KIM, Churchill (KR)
Download PDF:
Previous Patent: POWER MODULE
Next Patent: SEPARATOR STRUCTURE, MANUFACTURING METHOD THEREFOR, AND SECONDARY BATTERY USING SAME
Next Patent: SEPARATOR STRUCTURE, MANUFACTURING METHOD THEREFOR, AND SECONDARY BATTERY USING SAME