Title:
POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2021/230623
Kind Code:
A1
Abstract:
The present invention relates to a power module comprising: a lower ceramic substrate (200); an upper ceramic substrate (300) disposed above the lower ceramic substrate (200) and having a semiconductor chip (G) mounted on the lower surface thereof; and a heat sink (500) bonded to the lower surface of the lower ceramic substrate (200) and having slots (510, 520, 530) formed therein. The present invention has slots formed in the heat sink, and thus has the advantages of preventing deterioration between components with different coefficients of thermal expansion and preventing warping of the heat sink.
Inventors:
KIM JONGUK (KR)
BIN JINHYUCK (KR)
CHO TAEHO (KR)
YEO INTAE (KR)
PARK SEUNGGON (KR)
BIN JINHYUCK (KR)
CHO TAEHO (KR)
YEO INTAE (KR)
PARK SEUNGGON (KR)
Application Number:
PCT/KR2021/005887
Publication Date:
November 18, 2021
Filing Date:
May 11, 2021
Export Citation:
Assignee:
AMOSENSE CO LTD (KR)
International Classes:
H01L23/367; H01L23/15; H01L23/373; H01L23/492; H05K1/02; H05K1/03; H05K7/20
Foreign References:
| KR200358317Y1 | 2004-08-06 | |||
| KR20190110376A | 2019-09-30 | |||
| KR20180097021A | 2018-08-30 | |||
| KR20160148726A | 2016-12-26 | |||
| US20170213777A1 | 2017-07-27 |
Attorney, Agent or Firm:
KIM, Churchill (KR)
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