Title:
POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2022/135595
Kind Code:
A1
Abstract:
A power module, comprising an input positive electrode (11), an input negative electrode (12), an upper bridge substrate (9), a lower bridge substrate (3), an upper bridge chip (8), a lower bridge chip (5), an output electrode (6) and a signal transmission terminal (16), wherein the upper bridge substrate (9), the upper bridge chip (8), the lower bridge chip (5) and the lower bridge substrate (3) are stacked in sequence. A collector of the upper bridge chip (8) is connected to the upper bridge substrate (9), an emitter of the upper bridge chip (8) and a collector of the lower bridge chip (5) are respectively connected to the output electrode (6), the emitter sampling, the collector sampling and a control terminal of the upper bridge chip (8) and the emitter sampling, the collector sampling and a control terminal of the lower bridge chip (5) are respectively connected to the signal transmission terminal (16), the input positive electrode (11) is connected to the upper bridge substrate (9), and the input negative electrode (12) is connected to the lower bridge substrate (3).
Inventors:
SHI SHOUCAO (CN)
ZENG QIULIAN (CN)
LUO CHUANMING (CN)
WU HAIPING (CN)
ZENG QIULIAN (CN)
LUO CHUANMING (CN)
WU HAIPING (CN)
Application Number:
PCT/CN2021/141373
Publication Date:
June 30, 2022
Filing Date:
December 24, 2021
Export Citation:
Assignee:
BYD SEMICONDUCTOR COMPANY LTD (CN)
International Classes:
H01L23/31; H01L23/367
Foreign References:
| CN107146775A | 2017-09-08 | |||
| CN107170720A | 2017-09-15 | |||
| CN107170714A | 2017-09-15 | |||
| CN105070695A | 2015-11-18 | |||
| US20150255423A1 | 2015-09-10 | |||
| CN104134638A | 2014-11-05 | |||
| CN202011565454A | 2020-12-25 |
Attorney, Agent or Firm:
BEYOND TALENT PATENT AGENT FIRM (CN)
Download PDF: