Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2023/276100
Kind Code:
A1
Abstract:
The present disclosure relates to a power module comprising: a plurality of semiconductor elements through which a main electric current flows in a thickness direction; a substrate on which the plurality of semiconductor elements are mounted; a base plate on which the substrate is mounted; a case that is bonded to the base plate and houses the plurality of semiconductor elements; a plurality of main wiring boards that are incorporated into an upper portion of the case on the side thereof opposite to the base plate and are arranged parallel to the base plate; and a plurality of wires that are bonded to lower surfaces of the plurality of main wiring boards facing the plurality of semiconductor elements, an upper surface electrode of each of the plurality of semiconductor elements being electrically connected to the plurality of main wiring boards via the plurality of wires and a bonding material.

Inventors:
NAKAHARA KENTA (JP)
Application Number:
PCT/JP2021/024915
Publication Date:
January 05, 2023
Filing Date:
July 01, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L25/07; H01L25/18; H01L29/78
Foreign References:
JP2021040051A2021-03-11
JP2020013866A2020-01-23
JP2006186035A2006-07-13
JP2016163372A2016-09-05
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
Download PDF: