POWER SEMICONDUCTOR APPARATUS

WIPO Patent Application WO/2023/109605

A1

There is provided a power semiconductor apparatus 1000, comprising: a plurality of power semiconductor modules M1 to M4, each of which comprises at least one semiconductor chip; a plurality of coolers C1 to C5 stacked with the power semiconductor modules along a stacking direction Z, wherein each of the power semiconductor modules is thermally coupled to at least one of the coolers; first and second structural plates SP1, SP2 arranged on opposite sides of the stacked coolers and power semiconductor modules in the stacking direction, wherein the first and second structural plates are configured to pressurise the stacked coolers and power semiconductor modules in the stacking direction; a plurality of compliant components CP1 to CP8 arranged between at least one of the first and second structural plates and the stacked coolers and power semiconductor modules; and a pressure controller comprising first and second ends N1-N4, S1-S4 coupled to the first and second structural plates respectively, wherein a distance between the first and second ends is adjustable so as to control a pressure applied by the structural plates to the stacked coolers and power semiconductor modules in the stacking direction.

LI YUN (GB)
MA YAQING (GB)
LI JIANFENG (GB)
DONG FANGFANG (GB)
DU YUEKANG (GB)
ARCILLAS JOSEPH CASTILLO (GB)
YAN JIAYI (GB)

PCT/CN2022/137130

June 22, 2023

December 07, 2022

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ZHUZHOU CRRC TIMES ELECTRIC CO LTD (CN)

H01L23/40; H01L23/473; H01L25/18; H02M7/00; H01L23/00; H01L25/07

CN111970909A	2020-11-20
US20100302733A1	2010-12-02
US20150194367A1	2015-07-09
US20210293495A1	2021-09-23
US20090284921A1	2009-11-19
US10874037B1	2020-12-22
US20150214205A1	2015-07-30
US20160192539A1	2016-06-30
US20180026533A1	2018-01-25

NTD PATENT & TRADEMARK AGENCY LTD. (CN)

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