Title:
POWER SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/132803
Kind Code:
A1
Abstract:
This invention is provided with: a circuit board (5) mounted in a package (2), the circuit board (5) having formed thereon an electrical circuit including a power semiconductor element (6); and a plurality of press-fit terminals (3) having wire bond parts (35) electrically connected to the electrical circuit in the package (2), press-fit parts (32) for establishing an electrical connection with devices to be connected, and a body part (33) supported so that an end part continuous with the wire bond part (35) is fixed inside the package (2), and the other end part sets the press-fit parts (32) away from the package (2). Each of the press-fit terminals (3) has a constricted part (36) constricted from both sides in the direction perpendicular to the center line so as to preserve a portion at the center line, the constricted part (36) being formed at a portion of the body part (33) exposed from the package (2).
Inventors:
EGUSA MINORU (JP)
SHIGE KAZUYOSHI (JP)
SHIGE KAZUYOSHI (JP)
Application Number:
PCT/JP2014/053287
Publication Date:
September 04, 2014
Filing Date:
February 13, 2014
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L25/07; H01L23/48; H01L25/18
Foreign References:
| JP2011165836A | 2011-08-25 | |||
| JP2012151019A | 2012-08-09 | |||
| JP2011090797A | 2011-05-06 | |||
| US20090194884A1 | 2009-08-06 | |||
| JP2013004239A | 2013-01-07 |
Other References:
See also references of EP 2963684A4
Attorney, Agent or Firm:
OIWA Masuo et al. (JP)
Masuo Oiwa (JP)
Masuo Oiwa (JP)
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